Portfolio

Multi-Dimensional Materials

Advanced packaging materials for extreme environments require precise control of thermal transport and mechanical compliance.

Our research focuses on multi-dimensional composite processing with anisotropic structural design to mitigate thermo-mechanical mismatch under severe thermal cycling, enabling scalable manufacturing beyond conventional semiconductor packaging.

Laser Processing

Our group focuses on laser-enabled synthesis of advanced thin films using solution- and dry-based processes.We study diverse materials, including two-dimensional (2D) materials, dielectric layers, and emerging semiconductors, with an emphasis on understanding laser-induced photothermal and pyrolytic mechanisms.

By combining this knowledge with scalable coating, laser processing, and post-treatment strategies, we achieve wafer-scale, highly uniform functional thin films with controlled structure and electronic properties.

Devices

Our research extends to the design and fabrication of electronic and sensing devices, including transistors, diodes, and sensor arrays.
These devices serve as platforms for translating low-dimensional thin-film materials into functional, scalable device architectures.

By correlating material properties with device performance, we demonstrate wafer-scale integration, reliable operation, and application-relevant functionality for next-generation electronics and sensors.